Fast electromagnetic simulation for interconnects on high speed circuits

Abstract

This research work carries out the analysis of microstrip with gap discontinuity and bypass capacitors on the ground plane. The full wave approach is based on integral equations using the spatial domain Green's function in layered medium. Method of moment solution is obtained with RWG basis function and Galerkin testing. The method is applied to gaps with bypass capacitors in single and double layer structure. Simulation results were obtained for various values and locations of bypass capacitors and for the case of a second reference plane.This research work presents a full wave modeling technique for vertical vias in multi-layered integrated circuits. The analysis of the interior problem is based upon the cylindrical wave expansion of the magnetic field Green's function; the multiple interaction among vias is modeled by the Foldy-Lax scattering formula. Multi-layered effects are considered using cascaded network of the single-layered components. The exterior problem is analyzed using MOM approach and combined with interior problem into a system of equation to facilitate solution of large number of vias. Problems of several thousand vias are analyzed with moderate CPU and memory requirement. Numerical results are obtained for different via configurations and for large range of frequency. Also illustrated are results for differential signaling with surrounding idle and shorting vias.